PNP Paper - A4 Size

PNP Paper - A4 Size

Dry Film Exposure Method as an Alternative to Iron-on Method for Printed Circuit Board Manufacturing

1. Photographic paper is placed between two thin protective layers. One of these layers is removed with the help of tape.
2. The peeled side is glued to the cleaned copper plate. Care is taken to ensure that no air bubbles remain between the film and the copper plate.
3. The film is glued to the plate using a lamination device that is not too hot or an iron at a constant temperature.
4. A high-resolution printout is taken on transparent film or colorless acetate for the PCB. Since the film is a negative, the printout colors should be reversed.
5. After compressing the plate, film, and acetate between two glass panes to prevent them from slipping, the exposure process is carried out with UV fluorescent or LED; if these are not available, with an energy-saving bulb.
(It is recommended to expose the film for 2-3 minutes with a UV source or 20-25 minutes with a white light source until the paths become visible.)
6. After the exposure process is complete, the protective layer on the other side of the film is removed and it is placed in the developer solution. (1 gram developer: 100 grams water ratio, Developer: Pure Sodium Carbonate)
7. Depending on your choice, it is placed in an acid solution. As in the ironing method, it is left until the areas that need to melt melt.

By determining the most ideal times with film processing, a 4 mil path / 4 mil gap (0.01mm / 0.01mm) accuracy can be achieved.

Reminders:

• UV light is harmful to health. If a UV light source is used during exposure, necessary precautions must be taken.
• The film should be opened and processed in a dark environment (Only weak red light can be used as a source). Exposure to light may reduce the film's properties. Storage should be done in a dark environment.
• After purchase, it can be cut to the desired size and used.